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This comprehensive guide explains the iPhone X logic board replacement kit, detailing both the top and bottom layers. The top layer contains the CPU, ..
-520x350w.jpg "BGTOOLS BI-04 Chip Repair Fixture - Push-Type Adjustable Clamp for Phone CPU BGA Soldering")
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1. Product OverviewThe BGTOOLS BI-04 Chip Repair Fixture is a professional-grade push-type adjustable clamping solution designed specifically for mobi..
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We will attend Phone Repair Fest 2.0 Malaysia at IDCC Shah Alam on 13-14 June 2026. Welcome to visit our booth C36 & C42. We provide full series of pr..
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The BG C210 Detachable Micro Soldering Iron Heating Core with Replaceable Tips is the latest innovation from BGTOOLS and KEGUAN TECHNOLOGY, designed e..
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Introduction to Equipment OperationsHow to use tools like multimeter, oscilloscope, infrared thermography, etc., for mobile mainboard circuit detectio..
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When it comes to mobile mainboard repair, CPU faults are some of the most common—and trickiest—issues technicians face. This hands-on module teaches y..
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BG & KG Tools Unveils New 1,600 sqm Factory Building
We are thrilled to announce the official launch of our brand-new 1,600 square meter factory build..
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BG TOOLS 2026 Spring Festival Holiday NoticeBG TOOLS 2026 Spring Festival Holiday NoticeBG TOOLS 2026 Spring Festival Holiday NoticeBG TOOLS 2026 Spri..
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This chapter addresses basic common Iphone screen faults,
including cracked glass, touch unresponsiveness, backlight failure, and screen
discoloration..
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This chapter focuses on practical disassembly and
assembly of Iphone screens, including hot-dismantling (for OLED screens) and
cold-dismantling (for L..
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Detailed breakdown of the full range of Apple camera module structures, covering general models, common faults, pre-repair materials and tool operatio..