This comprehensive guide explains the iPhone X logic board replacement kit, detailing both the top and bottom layers. The top layer contains the CPU, logic chip, and hard disk, while the bottom layer features the baseband, baseband chip, WIFI, and NFC modules.

Key components include:

  • CPU & Logic Chip: Central processing and control, crucial for device operation.
  • Baseband & Baseband Chip: Responsible for cellular communication. Qualcomm versions are square, Intel versions are rectangular.
  • WIFI Module: Removable and reattachable for repairs or upgrades.
  • NFC: Fixed module; system restoration is required after replacement.
  • Hard Disk: Requires backup; supports 64GB/256GB replacement, with bottom layer data binding WIFI.

Replacement notes:

  • Top layer is universal for Intel versions. DFU mode can be connected via the S48 pin at 1.8V.
  • Bottom layer must match the appropriate baseband version (e.g., A1902 requires removing the original baseband).
  • WIFI can be removed from the bottom layer of the hard disk for repairs.

This guide is essential for technicians performing repairs or upgrades on iPhone X logic boards.