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KEGUAN KG-613 0.01mm Precision Fingerprint Repair Jumper Wire | 100m Ultra-Fine Copper Soldering Fly Line for Phone Motherboard PCB Electronic Repair
$3.43
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Precision Fingerprint Repair Jumper Wire
, KG-613 Fly Line
, KEGUAN Soldering Wire
, 0.01mm Ultra-Fine Jumper Wire
, Phone Motherboard Repair Wire
, PCB Soldering Fly Line
, High Purity Copper Jumper Wire
, High Conductivity Soldering Wire
, Break-Resistant Jumper Wire
, Electronic Repair Tool
, CPU Baseband Repair Wire
, No Paint Scraping Jumper Wire
, Micro Circuit Repair Accessory
KEGUAN KG-613 Precision Fingerprint Repair Fly Line is a professional-grade, high-precision electronic repair accessory, specially developed for ultra-fine circuit soldering and micro repair scenarios, manufactured by KEGUAN TECHNOLOGY.
This jumper wire adopts an ultra-fine 0.01mm wire diameter with a total length of 100m, packaged in a 4949mm compact spool (outer package size 80100mm), which is easy to store and operate in precision maintenance work. Made of high-purity copper material, it has excellent strong conductivity, zero resistance, no breakpoints, and non-magnetic properties. The wire has outstanding stretchability, superior toughness, and breakage resistance, with high anti-interference performance, ensuring stable and reliable soldering effect in micro repair operations. It supports direct soldering without paint scraping, which greatly improves the efficiency of circuit board repair.
This product is specially designed for ultra-fine straight flying wire dot repair, suitable for motherboard pad missing repair, motherboard screw hole wire breakage fixing, fingerprint flex cable repair, CPU and baseband dot flying wire repair, especially for iPhone motherboard repair, as well as general PCB circuit board soldering and various electronic maintenance jumper wiring. It is an essential tool for professional electronic maintenance technicians, mobile phone repair workers and electronics enthusiasts, providing a high-performance and stable solution for precision circuit repair.
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